Precision instruments, equipment PCBA,FPC SMD application
Parylene's application in precision electronic equipment PCBA, FPC, SMD
The Parylene coating is formed spontaneously on the component at room temperature and does not require a temperature-increasing curing process. It does not require a temperature above room temperature and more time to apply to the substrate. Parylene's high mechanical strength and low coefficient of friction combine to make Parylene the only insulating layer for small wire wound components. Parylene is the best protective material for these advanced assembly methods. The good penetrating power of Parylene's active molecules creates a high-quality protective layer with no air gap inside and around the element.